I-45V 2000A 90KW Air Cooling IGBT Type Rectifier ye-Electroplating
uphawu
Imodeli kunye neDatha
| Inombolo yomzekelo | I-ripple yemveliso | Ukuchaneka kwesiboniso sangoku | Ukuchaneka komboniso weVolt | Ukuchaneka kwe-CC/CV | Ukunyuka nokwehla | Ukudubula ngaphezulu |
| I-GKD45-2000CVC | I-VPP≤0.5% | ≤10mA | ≤10mV | ≤10mA/10mV | 0~99S | No |
Izicelo zeMveliso
Ishishini lesicelo: I-PCB Naked layer copper plating
Kwinkqubo yokuvelisa i-PCB, i-electroless copper plating linyathelo elibalulekileyo. Isetyenziswa kakhulu kwezi nkqubo zimbini zilandelayo. Enye iplating kwi-laminate engenanto kwaye enye iplating ngomngxuma, kuba phantsi kwezi meko zimbini, i-electroplating ayinakwenziwa okanye ayinakwenzeka. Kwinkqubo yoplating kwi-laminate engenanto, iipleyiti ze-electroless copper plating umaleko omncinci wobhedu kwi-substrate engenanto ukwenza i-substrate ibe yi-conductive ukuze i-electroplating iqhubeke. Kwinkqubo yoplating ngomngxuma, i-electroless copper plating isetyenziselwa ukwenza iindonga zangaphakathi ze-hole conductive ukudibanisa iisekethe eziprintiweyo kwiileya ezahlukeneyo okanye iiphini zeetships ezidibeneyo.
Umgaqo wokufakwa kwe-copper ngaphandle kwe-electron kukusebenzisa i-chemical reaction phakathi kwe-reducing agent kunye ne-copper salt kwisisombululo solwelo ukuze i-copper ion incitshiswe ibe yi-atom ye-copper. I-reaction mayiqhubeke ukuze i-copper eyaneleyo yenze ifilimu ize igubungele i-substrate.
Olu luhlu lwe-rectifier luyilwe ngokukodwa kwi-PCB Naked layer copper plating, lusebenzisa ubungakanani obuncinci ukuze lulungelelaniswe indawo yokufaka, umbane ophantsi nophezulu unokulawulwa ngokutshintsha okuzenzakalelayo, ukupholisa umoya kusetyenziswa i-air duct evaliweyo ezimeleyo, ukulungiswa okuhambelanayo kunye nokonga amandla, ezi mpawu ziqinisekisa ukuchaneka okuphezulu, ukusebenza okuzinzileyo kunye nokuthembeka.
Qhagamshelana nathi
(Ungangena kwaye ugcwalise ngokuzenzekelayo.)
