45V 2000A 90KW Ukupholisa uMoya wohlobo lwe-IGBT yoLungiso lwe-Electroplating

Ingcaciso yeMveliso:

Iinkcukacha:

Iiparamitha zokufaka: Isigaba sesithathu AC415V±10%, 50HZ

Iiparamitha zemveliso: DC 0~45V 0~2000A

Imo yemveliso: Imveliso eqhelekileyo yeDC

Indlela yokupholisa: Ukupholisa umoya

Uhlobo lonikezelo lwamandla: I-IGBT-based High-frequency Power Supply

Thumela i-imeyile kuthi

Inkcazo
Uhlobo lweFaucet	IiFaucets zeBathroom Sink,
Uhlobo loFakelo	Iseti yangaphakathi,
Imingxunya yoFakelo	Umngxuma omnye,
Inani leeHandle	Umqheba omnye,
Gqiba	Ti-PVD,
Isimbo	Ilizwe,
Umgangatho wohambo	1.5 GPM (5.7 L/min) ubuninzi,
Uhlobo lweValve	Ivalve yeCeramic,
Ukutshintsha okubandayo kunye nokushushu	Ewe,
Imilinganiselo
Ubude bubonke	240 mm ( 9.5 "),
Spout Height	155 mm ( 6.1 "),
Ubude beSpout	160 mm ( 6.3 "),
Iziko lombhobho	Umngxuma omnye,
Izinto eziphathekayo
Isixhobo soMzimba weFaucet	Ubhedu,
Isixhobo seFaucet Spout	Ubhedu,
Isixhobo seFaucet Handle	Ubhedu,
Ulwazi lwezixhobo
Ivalve ifakiwe	Ewe,
Umsele uqukiwe	Hayi,
Ubunzima
Ubunzima obububo (kg)	0.99,
Ubunzima bokuthumela ngenqanawe (kg)	1.17,

uphawu

Iiparamitha zoNgeno

Igalelo le-AC 480v±10% iSigaba sesi-3
Iiparamitha zokuPhuma

DC 0~50V 0~5000A ngokuqhubekayo adjustable
Amandla emveliso

250KW
Indlela yokupholisa

ukupholisa umoya ngenkani / ukupholisa amanzi
Ianalog yePLC

0-10V/ 4-20mA/ 0-5V
Ujongano

RS485/ RS232
Imo Yokulawula

uyilo lokulawula kude
Umboniso weSkrini

umboniso wedijithali
Ukhuseleko oluninzi

Ukungabikho kwesigaba sokufudumeza ngaphezulu kwe-voltage ngaphezulu kwesekethe emfutshane yangoku
Indlela yokulawula

PLC / Microcontroller

Imodeli kunye neDatha

Inombolo yomzekelo	Imveliso ripple	Ukuchaneka komboniso wangoku	Ukuchaneka komboniso weVolt	CC/CV Ukuchaneka	I-Ramp-up kunye ne-ramp-down	Ukudubula ngaphezulu
I-GKD45-2000CVC	VPP≤0.5%	≤10mA	≤10mV	≤10mA/10mV	0~99S	No

Izicelo zeMveliso

Ushishino lweSicelo: PCB Umaleko oze weplanga lobhedu

Kwinkqubo yokwenziwa kwe-PCB, i-electroless copper plating linyathelo elibalulekileyo.Isetyenziswa ngokubanzi kwezi nkqubo zimbini zilandelayo.Enye ityabeka kwi-laminate engenanto kwaye enye ityabeka emngxunyeni, kuba phantsi kwezi meko zimbini, i-electroplating ayinakwenzeka okanye ayinakwenzeka.Kwinkqubo yokwandlala kwi-laminate engenanto, iipleyiti zobhedu ezingena-electroless umaleko obhityileyo wobhedu kwi-substrate engenanto ukwenza i-substrate iqhube ukutyhala ngakumbi.Kwinkqubo yokugcoba ngomngxunya, i-electroless copper plating isetyenziselwa ukwenza iindonga zangaphakathi ze-hole conductive ukudibanisa iisekethe eziprintiweyo kwimigangatho eyahlukeneyo okanye izikhonkwane zeechips ezidibeneyo.

Umgaqo wokubekwa kobhedu olungena-electro kukusebenzisa ukusabela kweekhemikhali phakathi kwe-arhente yokunciphisa kunye netyuwa yobhedu kwisisombululo solwelo ukuze i-ion yobhedu ithotywe ibe yi-athomu yobhedu.Ukusabela kufuneka kuqhubeke ukwenzela ukuba ubhedu olwaneleyo lunokwenza ifilimu kwaye lugubungele i-substrate.

Olu ngcelele lwe-rectifier luyilelwe ngokukhethekileyo i-PCB ye-Naked layer copper plating, yamkele ubungakanani obuncinci ukwenza indawo yokufakela ibe ngcono, i-low kunye nephezulu yangoku inokulawulwa ngokutshintsha okuzenzekelayo, ukupholisa umoya kusetyenziswa umbhobho womoya ozimeleyo ovalelweyo, ukulungiswa kwe-synchronous kunye nokugcina amandla, ezi mpawu ziqinisekisa ukuchaneka okuphezulu, ukusebenza okuzinzileyo kunye nokuthembeka.