Inombolo yomzekelo | Imveliso ripple | Ukuchaneka komboniso wangoku | Ukuchaneka komboniso weVolt | CC/CV Ukuchaneka | I-Ramp-up kunye ne-ramp-down | Ukudubula ngaphezulu |
I-GKD15-300CVC | VPP≤0.5% | ≤10mA | ≤10mV | ≤10mA/10mV | 0~99S | No |
Umphezulu wokuphatha i-electroplate ye-chrome, igolide, isilivere, i-nickel, i-zinc, isinyithi, ibhodi yePCB kunye njl.
I-Copper plating: i-priming, iphucula ukukwazi ukunamathela kumaleko wokutya, kunye nokukwazi ukumelana nokubola. (I-Copper ilula kwi-oxidation, i-oxidation, i-copper eluhlaza ayisekho conductive, ngoko ke iimveliso zobhedu kufuneka zenze ukhuseleko lobhedu)
I-Nickel plating: i-priming okanye imbonakalo, ukunyusa ukuxhathisa ukubola kunye nokumelana nokuguga, (apho i-nickel yekhemikhali yenkqubo yanamhlanje yokuxhathisa ukunxiba kune-chrome plating). (Qaphela ukuba iimveliso ezininzi ze-elektroniki, ezifana nentloko ye-DIN, intloko ye-N, ayisasebenzisi i-nickel priming, ngakumbi ngenxa yokuba i-nickel inomagnetic, iya kuchaphazela iimpawu zombane ngaphakathi kwe-intermodulation yokwenziwa)
(Unako kwakhona Ngena kwaye ugcwalise ngokuzenzekelayo.)