| Inombolo yomzekelo | I-ripple yemveliso | Ukuchaneka kwesiboniso sangoku | Ukuchaneka komboniso weVolt | Ukuchaneka kwe-CC/CV | Ukunyuka nokwehla | Ukudubula ngaphezulu |
| I-GKD15-300CVC | I-VPP≤0.5% | ≤10mA | ≤10mV | ≤10mA/10mV | 0~99S | No |
I-electroplate yokunyanga umphezulu we-chrome, igolide, isilivere, i-nickel, i-zinc, isinyithi, ibhodi ye-PCB njl.
Ukugquma ngentsimbi: ukugquma ngentsimbi, ukuphucula amandla okunamathela kumaleko wokugquma, kunye nokukwazi ukumelana nokugqwala. (Ubhedu kulula ukulugquma, ukugquma ngentsimbi, ubhedu oluhlaza alusekho, ngoko ke iimveliso ezigqunywe ngentsimbi kufuneka zikhusele ubhedu)
I-Nickel plating: i-priming okanye imbonakalo, ukuphucula ukumelana nokugqwala kunye nokumelana nokuguguleka, (apho i-nickel yekhemikhali yenkqubo yanamhlanje yokumelana nokuguguleka kune-chrome plating). (Qaphela ukuba iimveliso ezininzi ze-elektroniki, ezifana ne-DIN head, i-N head, azisasebenzisi i-nickel priming, ikakhulu ngenxa yokuba i-nickel inomtsalane, iya kuchaphazela iipropati zombane ngaphakathi kwe-passive intermodulation)
(Ungangena kwaye ugcwalise ngokuzenzekelayo.)