Ukucwenga kwesinyithi yinkqubo ebandakanya ukubeka umaleko wesinyithi kumphezulu wenye imathiriyeli. Oku kwenziwa ngeenjongo ezahlukeneyo, kubandakanywa nokuphucula inkangeleko, ukuqinisa ukuxhathisa ukubola, ukubonelela ukuxhathisa ukunxiba, kunye nokwenza ngcono ukuqhuba. Kukho iintlobo ngeentlobo zeendlela zokucwenga zesinyithi, nganye inemisebenzi eyahlukileyo kunye neenzuzo. Nazi ezinye zeentlobo eziqhelekileyo:
I-Electroplating: I-Electroplating yeyona ndlela isetyenziswa kakhulu yentsimbi yokucwenga. Kubandakanya ukuntywiliselwa into eza kucandwa (i-substrate) kwisisombululo esine-ion zetsimbi zezinto zokucoca. Umbane othe ngqo ugqithiswa kwisisombululo, obangela ukuba i-ion zetsimbi zihambelane nomgangatho we-substrate, zenze i-uniform kunye ne-adherent metal coating. I-Electroplating isetyenziswa kumashishini ahlukeneyo, kubandakanya iimoto, i-elektroniki, kunye nobucwebe, ngeenjongo zokuhombisa kunye nokusebenza.
I-Electroless Plating: Ngokungafaniyo ne-electroplating, i-electroless plating ayifuni umbane wangaphandle. Endaweni yoko, ukusabela kweekhemikhali phakathi kwe-arhente yokunciphisa kunye neeoni zetsimbi kwisisombululo kubeka isinyithi kwi-substrate. Ukufakwa kwe-Electroless plating kwaziwa ngokukwazi ukugquma iimilo ezintsonkothileyo kunye neendawo ezingaqhubekiyo. Idla ngokusetyenziswa ekuvelisweni kweebhodi zesekethe eziprintiweyo (PCBs) nakumashishini apho kufuneka ulawulo olungqingqwa oluchanekileyo.
I-Immersion Plating: Ukucwiliswa kokuntywila kuyindlela elula ebandakanya ukucwiliswa kwe-substrate kwisisombululo esinetyuwa yesinyithi. Iiyoni zetsimbi kwisisombululo zihambelana nomphezulu we-substrate, zenza uluhlu oluncinci lwentsimbi efunwayo. Le nkqubo isoloko isetyenziselwa izicelo ezincinci kwaye njengenyathelo lonyango lwangaphambili kwezinye iinkqubo zokucwenga.
I-Vacuum Deposition (i-PVD kunye ne-CVD): i-Physical Vapor Deposition (PVD) kunye ne-Chemical Vapor Deposition (CVD) bubuchule obusetyenziselwa ukufaka iifilimu zentsimbi ezibhityileyo kwi-substrates kwindawo yokufunxa. I-PVD ibandakanya ukwenziwa komphunga kwesinyithi kwigumbi lokufunxa, kulandelwa kukubekwa kwayo kumphezulu we-substrate. I-CVD, ngakolunye uhlangothi, isebenzisa ukuphendulwa kweekhemikhali ukwenza i-coating yentsimbi. Ezi ndlela zisetyenziswa kwishishini le-semiconductor, i-optics, kunye neengubo zokuhombisa.
I-Anodizing: I-Anodizing luhlobo oluthile lwe-electrochemical plating esetyenziswa ikakhulu kwi-aluminium kunye ne-alloys yayo. Kubandakanya ukwenza umaleko we-oxide olawulwayo kumphezulu wesinyithi. I-Anodizing ibonelela ngokuphucuka kokumelana nomhlwa, ukuxhathisa ukunxiba okuphuculweyo, kwaye ingasetyenziselwa iinjongo zokuhombisa.
I-Galvanization: I-galvanization ibandakanya ukugquma intsimbi okanye intsimbi kunye nomaleko we-zinc ukukhusela ngokuchasene nokuhlwa. Eyona ndlela ixhaphakileyo yi-hot-dip galvanization, apho i-substrate intywiliselwa kwi-zinc etyhidiweyo. I-galvanization isetyenziswa ngokubanzi kumashishini okwakha kunye neemoto.
I-Tin Plating: I-Tin Plating isetyenziselwa ukukhusela ngokuchasene nokuhlwa, ukuphucula ukubola, kunye nokubonelela ngenkangeleko eqaqambileyo, ekhanyayo. Idla ngokusetyenziswa kwishishini lokupakisha ukutya (iitoti) kunye ne-elektroniki.
Ukufakwa kweGolide: Ukubekwa kwegolide kubonelela ngokumelana nokugqwesa okugqwesileyo, ukuhanjiswa kombane, kunye nesibheno sobuhle. Ihlala isetyenziswa kwishishini le-elektroniki, ngakumbi kwizihlanganisi kunye nabafowunelwa.
I-Chrome Plating: I-Chrome plating iyaziwa ngezakhiwo zayo zokuhombisa kunye ne-corrosion-resistant. Iqhele ukusetyenziswa kwimizi-mveliso yeemoto kunye negumbi lokuhlambela.
Uhlobo ngalunye lwesinyithi luneenzuzo kunye nokusetyenziswa okuthe ngqo, okwenza kube yinkqubo ebalulekileyo kumashishini ahlukeneyo. Ukukhethwa kwendlela yokucoca kuxhomekeke kwiipropati ezifunwayo zemveliso egqityiweyo kunye nezinto ezichaphazelekayo.
Ixesha lokuposa: Sep-07-2023
