Ukugquma ngentsimbi yinkqubo equka ukufaka umaleko wesinyithi phezu komphezulu wesinye isixhobo. Oku kwenziwa ngeenjongo ezahlukeneyo, kubandakanya ukuphucula inkangeleko, ukuphucula ukumelana nokugqwala, ukunika ukumelana nokuguguleka, kunye nokwenza kube lula ukuqhuba kakuhle. Kukho iintlobo ezahlukeneyo zeendlela zokugquma ngentsimbi, nganye inezicelo zayo ezikhethekileyo kunye neenzuzo. Nazi ezinye zezona ntlobo zixhaphakileyo:
Ukufaka i-Electroplating: Ukufaka i-Electroplating yeyona ndlela isetyenziswa kakhulu yokufakela isinyithi. Kubandakanya ukuntywilisela into eza kufakelwa isinyithi (i-substrate) kwisisombululo esinee-ion zesinyithi zezinto zokufaka isinyithi. Umbane othe ngqo udlula kwisisombululo, nto leyo ebangela ukuba ii-ion zesinyithi zinamathele kumphezulu we-substrate, nto leyo eyenza i-metal coating efanayo nenamathelayo. Ukufaka i-Electroplating kusetyenziswa kumashishini ahlukeneyo, kuquka iimoto, izixhobo ze-elektroniki, kunye nezacholo, ngeenjongo zokuhombisa nokusebenza.
I-Electroless Plating: Ngokungafaniyo ne-electroplating, i-electroless plating ayifuni mbane wangaphandle. Endaweni yoko, i-chemical reaction phakathi kwe-reducing agent kunye nee-metal ions kwisisombululo ibeka isinyithi kwi-substrate. I-Electroless plating yaziwa ngokukwazi kwayo ukugquma iimilo ezintsonkothileyo kunye neendawo ezingahambisi mbane. Isetyenziswa kakhulu kwimveliso yeebhodi zesekethe eziprintiweyo (ii-PCB) nakwimizi-mveliso apho kufuneka ulawulo oluchanekileyo lobukhulu.
Ukugquma nge-immersion: Ukugquma nge-immersion yindlela elula equka ukugquma i-substrate kwisisombululo esinetyuwa yesinyithi. Ii-ion zesinyithi kwisisombululo zinamathela kumphezulu we-substrate, zenze umaleko omncinci wesinyithi esifunekayo. Le nkqubo idla ngokusetyenziswa kwizicelo ezincinci kwaye njengenyathelo langaphambi konyango kwezinye iinkqubo zokugquma.
Ukususwa kweVacuum (PVD kunye neCVD): Ukususwa kweVapor Physical (PVD) kunye nokususwa kweVapor yeKhemikhali (CVD) ziindlela ezisetyenziselwa ukufaka iifilimu zesinyithi ezibhityileyo kwi-substrates kwindawo ye-vacuum. I-PVD ibandakanya ukufuthwa kwesinyithi kwigumbi le-vacuum, kulandele ukufakwa kwaso kumphezulu we-substrate. I-CVD, kwelinye icala, isebenzisa ii-chemical reactions ukwenza uqweqwe lwesinyithi. Ezi ndlela zisetyenziswa kwishishini le-semiconductor, i-optics, kunye neengubo zokuhombisa.
Ukufunxa: Ukufunxa luhlobo oluthile lweplating ye-electrochemical esetyenziswa kakhulu kwi-aluminium kunye nee-alloys zayo. Kubandakanya ukudala umaleko we-oxide olawulwayo kumphezulu wesinyithi. Ukufunxa kunika ukumelana nokugqwala okuphuculweyo, ukumelana nokuguguleka okuphuculweyo, kwaye kungasetyenziselwa iinjongo zokuhombisa.
Ukudibanisa i-Galvanization: Ukudibanisa i-Galvanization kubandakanya ukugquma intsimbi okanye intsimbi ngomaleko we-zinc ukukhusela ukugqwala. Eyona ndlela ixhaphakileyo kukusebenzisa i-hot-dip galvanization, apho i-substrate intywiliselwa kwi-zinc enyibilikisiweyo. Ukudibanisa i-Galvanization kusetyenziswa kakhulu kumashishini okwakha kunye neemoto.
Ukugquma ngeTin: Ukugquma ngeTin kusetyenziselwa ukukhusela ekungcoleni, ukuphucula ukutyibilika, nokubonelela ngenkangeleko eqaqambileyo nekhazimlayo. Kusetyenziswa kakhulu kwishishini lokupakisha ukutya (iitini) kunye nezixhobo ze-elektroniki.
I-Gold Plating: I-Gold plating inika ukumelana nokugqwala okugqwesileyo, ukuhanjiswa kombane, kunye nomtsalane wobuhle. Ihlala isetyenziswa kushishino lwe-elektroniki, ngakumbi kwizihlanganisi kunye nezihlanganisi.
I-Chrome Plating: I-Chrome plating yaziwa ngeempawu zayo zokuhombisa kunye nokumelana nokugqwala. Isetyenziswa kakhulu kwimizi-mveliso yeemoto kunye nezixhobo zokuhlambela.
Uhlobo ngalunye lokugquma ngesinyithi luneengenelo zalo kunye nokusetyenziswa okuthile, nto leyo eyenza ukuba lube ziinkqubo ezibalulekileyo kumashishini ahlukeneyo. Ukukhetha indlela yokugquma kuxhomekeke kwiimpawu ezifunwayo zemveliso egqityiweyo kunye nezinto ezisetyenzisiweyo.
Ixesha lokuthumela: Sep-07-2023
