Iibhodi zeSekethe eziprintiweyo (PCBs) ziyinxalenye yezixhobo zombane zanamhlanje, ezisebenza njengesiseko samacandelo enza ezi zixhobo zisebenze. IiPCBs zinemathiriyeli engaphantsi, eyenziwe ngefiberglass ngokwesiqhelo, eneendlela eziqhutywayo ezichwethelweyo okanye eziprintiweyo kumphezulu ukudibanisa izinto ezahlukeneyo ze-elektroniki. Umba omnye obalulekileyo wokwenziwa kwe-PCB kukwenza iplating, edlala indima ebalulekileyo ekuqinisekiseni ukusebenza kunye nokuthembeka kwePCB. Kweli nqaku, siza kuphonononga kwinkqubo yokufakwa kwe-PCB, ukubaluleka kwayo, kunye neentlobo ezahlukeneyo zokucwenga ezisetyenziswa kwimveliso yePCB.
Yintoni PCB Plating?
Ukucwenga kwePCB yinkqubo yokubeka umaleko obhityileyo wesinyithi kumphezulu we-PCB substrate kunye neendlela zokuqhuba. Olu cwecwe lusebenza ngeenjongo ezininzi, kubandakanywa nokuphucula ukuqhutywa kweendlela, ukukhusela imiphezulu yobhedu evezwayo kwi-oxidation kunye nokubola, kunye nokubonelela ngomphezulu wokuthengisela amacandelo e-elektroniki ebhodini. Inkqubo yokucwenga iqhele ukwenziwa kusetyenziswa iindlela ezahlukeneyo ze-electrochemical, ezinje nge-electroless plating okanye i-electroplating, ukufezekisa ubukhulu obufunwayo kunye neempawu zomaleko ocandiweyo.
Ukubaluleka kokuPlathwa kwePCB
Ukucwenga kweePCB kubalulekile ngenxa yezizathu ezininzi. Okokuqala, kuphucula ukuqhutyelwa kweendlela zethusi, ukuqinisekisa ukuba iimpawu zombane zinokuhamba ngokufanelekileyo phakathi kwamacandelo. Oku kubaluleke kakhulu kwizicelo eziphezulu ze-frequency kunye nesantya esiphezulu apho ukunyaniseka komqondiso kubaluleke kakhulu. Ukongeza, umaleko ocwengisiweyo usebenza njengesithintelo ngokuchasene nezinto ezisingqongileyo ezinjengokufuma kunye nezinto ezingcolisayo, ezinokuthoba ukusebenza kwePCB ngokuhamba kwexesha. Ngaphezu koko, i-plating inikezela indawo yokudibanisa, evumela ukuba izinto ze-elektroniki zifakwe ngokukhuselekileyo ebhodini, zenze uqhagamshelwano oluthembekileyo lombane.
Iindidi PCB Plating
Kukho iindidi ezininzi zokucwenga ezisetyenziswa kwimveliso yePCB, nganye ineempawu zayo ezizodwa kunye nokusetyenziswa kwayo. Ezinye zezona ntlobo zixhaphakileyo ze-PCB yokucwenga ziquka:
1. I-Electroless Nickel Immersion Gold (ENIG): I-ENIG i-plating isetyenziswa ngokubanzi kwi-PCB yokuvelisa ngenxa yokumelana nokugqwala okugqwesileyo kunye nokuthengiswa kwayo. Iquka umaleko obhityileyo we-nickel engena-electro elandelwa ngumaleko wegolide entywiliselwayo, ebonelela ngomphezulu osicaba kunye nogudileyo wokuthengisa ngelixa ukhusela ubhedu olungaphantsi kwi-oxidation.
2. Igolide ye-Electroplated: I-Electroplated Gold plating iyaziwa ngokuba yi-conductivity ekhethekileyo kunye nokuchasana nokungcoliswa, okwenza kube yinto efanelekileyo kwizicelo apho ukuthembeka okuphezulu kunye nokuphila ixesha elide kuyadingeka. Ihlala isetyenziselwa izixhobo zombane eziphezulu kunye nezicelo ze-aerospace.
3. I-Electroplated Tin: I-Tin plating iqhele ukusetyenziswa njengokhetho olungabizi kakhulu kwiiPCBs. Inika ukuthengiswa okulungileyo kunye nokuxhathisa ukubola, okwenza ukuba ifaneleke kwizicelo zenjongo jikelele apho ixabiso liyinto ebalulekileyo.
4. Isilivere ye-Electroplated: I-Silver plating inikezela nge-conductivity egqwesileyo kwaye isoloko isetyenziswa kwizicelo ze-high-frequency apho ukunyaniseka komqondiso kubaluleke kakhulu. Nangona kunjalo, ityekele ekungcolisweni xa ithelekiswa nokubekwa kwegolide.
Inkqubo yoKubeka
Inkqubo yokucwenga ngokuqhelekileyo iqala ngokulungiswa kwe-PCB substrate, ebandakanya ukucoca kunye nokuvula umphezulu womhlaba ukuqinisekisa ukunamathela ngokufanelekileyo komaleko ocandiweyo. Kwimeko yokufakwa kwe-electroless plating, ibhafu yeekhemikhali equlethe isinyithi yokucoca isetyenziselwa ukufaka umaleko obhityileyo kwi-substrate nge-catalytic reaction. Kwelinye icala, i-electroplating ibandakanya ukuntywiliselwa kwe-PCB kwisisombululo se-electrolyte kunye nokudlulisa umsinga wombane kuyo ukuze idipozithe isinyithi phezu komhlaba.
Ngexesha lenkqubo yokucwenga, kubalulekile ukulawula ukutyeba kunye nokufana komgangatho ocwecweyo ukuhlangabezana neemfuno ezithile zoyilo lwePCB. Oku kuphunyezwa ngolawulo oluchanekileyo lweeparamitha zeplating, ezinje ngokwakheka kwesisombululo seplating, ubushushu, ingxinano yangoku, kunye nexesha lokucoca. Amanyathelo okulawula umgangatho, kubandakanywa umlinganiselo wobunzima kunye neemvavanyo zokubambelela, nazo zenziwa ukuze kuqinisekiswe ukunyaniseka komgangatho owenziweyo.
Imingeni kunye neNgqwalasela
Ngelixa iPCB yokucwenga ibonelela ngeenzuzo ezininzi, kukho imingeni ethile kunye neengqwalasela ezinxulumene nenkqubo. Omnye umceli mngeni oqhelekileyo kukufumana ubukhulu beplate efanayo kuyo yonke i-PCB, ngakumbi kuyilo oluntsonkothileyo olunobunzima obahlukeneyo. Iingqwalasela ezifanelekileyo zokuyila, ezifana nokusetyenziswa kweemaski zokucoca kunye neetrayisi ezilawulwayo ze-impedance, ziyimfuneko ukuze kuqinisekiswe ukubethelwa okufanayo kunye nokusebenza kombane okungaguqukiyo.
Iingqwalasela zokusingqongileyo nazo zidlala indima ebalulekileyo kwi-PCB yokucwenga, njengoko iikhemikhali kunye nenkunkuma eveliswa ngexesha lenkqubo yokucoca inokuba neempembelelo zokusingqongileyo. Ngenxa yoko, abavelisi abaninzi be-PCB bamkela iinkqubo zokucoca ezivumelana nokusingqongileyo kunye nezixhobo zokunciphisa impembelelo kokusingqongileyo.
Ukongeza, ukhetho lwezinto zokubeka kunye nobukhulu kufuneka zihambelane neemfuno ezithile zesicelo sePCB. Umzekelo, iisekethe zedijithali ezinesantya esiphezulu zinokufuna ukucolwa okukhulu ukuze kuncitshiswe ilahleko yomqondiso, ngelixa i-RF kunye neesekethe ze-microwave zinokuxhamla kwizinto ezikhethekileyo zokucoca ukugcina imfezeko yomqondiso kumaza aphezulu.
Ixesha elizayo kwi-PCB Plating
Njengoko itekhnoloji iqhubeka nokuhambela phambili, intsimi yePCB yokucwenga nayo iyavela ukuze ihlangabezane neemfuno zesizukulwana esilandelayo sezixhobo zombane. Enye intsingiselo ephawulekayo kuphuhliso lwezixhobo zokwaleka eziphucukileyo kunye neenkqubo ezibonelela ngokuphucuka kokwenziwa komsebenzi, ukuthembeka, kunye nokuzinza kokusingqongileyo. Oku kubandakanya ukuphononongwa kwezinye iintsimbi zokucwenga kunye nokugqitywa komphezulu ukujongana nobunzima obukhulayo kunye nokwenziwa kancinci kwezinto zombane.
Ngaphaya koko, ukudityaniswa kweendlela eziphambili zokucwenga, ezinje nge-pulse kunye ne-reverse pulse plating, ifumana ukutsaleka ukufezekisa ubungakanani beempawu ezigqwesileyo kunye nemilinganiselo ephezulu yoyilo kuyilo lwePCB. Ezi ndlela zobuchule zenza kube lula ukulawula inkqubo yokucwenga, okukhokelela ekufanisweni okuphuculweyo kunye nokungaguquguquki kuyo yonke i-PCB.
Ukuqukumbela, ukufakwa kwe-PCB ngumba obalulekileyo wokwenziwa kwe-PCB, idlala indima ebalulekileyo ekuqinisekiseni ukusebenza, ukuthembeka, kunye nokusebenza kwezixhobo zombane. Inkqubo yokucwenga, kunye nokukhethwa kwezinto zokucoca kunye nobuchule, ichaphazela ngokuthe ngqo iipropathi zombane kunye nezomatshini zePCB. Njengoko itekhnoloji iqhubeka nokuhambela phambili, uphuhliso lwezisombululo ezitsha zokwenziwa kweeplating luya kubaluleka ukuhlangabezana neemfuno eziguqukayo zeshishini le-elektroniki, ukuqhuba inkqubela phambili eqhubekayo kunye nokuveliswa kwezinto ezintsha kwi-PCB yokwenziwa.
T: PCB Plating: Ukuqonda Inkqubo kunye nokubaluleka kwayo
D: Iibhodi zeSekethe eziprintiweyo (PCBs) ziyinxalenye ebalulekileyo yezixhobo zombane zanamhlanje, ezisebenza njengesiseko samacandelo enza ezi zixhobo zisebenze. IiPCBs zinemathiriyeli engaphantsi, eyenziwe ngefiberglass ngokwesiqhelo, eneendlela eziqhutywayo ezichwethelweyo okanye eziprintiweyo kumphezulu ukudibanisa izinto ezahlukeneyo ze-elektroniki.
K: i-pcb plating
Ixesha lokuposa: Aug-01-2024
