1.Yintoni iPCB Electroplating?
I-PCB electroplating ibhekisa kwinkqubo yokubeka umaleko wesinyithi kumphezulu we-PCB ukuphumeza uqhagamshelo lombane, ukuhanjiswa komqondiso, ukutshatyalaliswa kobushushu, kunye neminye imisebenzi. I-DC Electroplating yesiNtu ithwaxwa yimiba efana nokungafane kufowunelwe, ukungonelanga kobunzulu bokuyila, kunye neziphumo zomphetho, zenza kube nzima ukuhlangabezana neemfuno zokwenziwa kwee-PCB eziphambili ezifana neebhodi ze-High-Density Interconnect (HDI) kunye neFlexible Printed Circuits (FPC). Unikezelo lwamandla okutshintsha okukwi-high-frequency luguqula umbane ongundoqo we-AC ukuya kwi-high-frequency AC, ethi emva koko ilungiswe kwaye ihluzwe ukuvelisa i-DC ezinzileyo okanye i-pulsed current. Iifrikhwensi zazo zokusebenza zinokufikelela kumashumi okanye namakhulu eekhilohertz, ezodlula kakhulu amandla ombane (50/60Hz) obonelelo lwamandla lweDC lwemveli. Olu phawu luphezulu luzisa iingenelo ezininzi kwi-PCB electroplating.
2.Izinto eziluncedo zokuTshintsho lwaMandla oMbane oPhezulu kwiPCB Electroplating
I-Coating Coating Uniformity: "Impembelelo yesikhumba" ye-high-frequency currents ibangela ukuba i-current igxininise kumphezulu we-conductor, iphucule ngokufanelekileyo ukufana kweengubo kunye nokunciphisa imiphumo enqeni. Oku kuluncedo ngakumbi ekubetheleni izakhiwo ezintsonkothileyo njengemigca emihle kunye nemingxuma emincinci.
Ukwandiswa kobuNtu bokuPlatha obunzulu: Imisinga ephezulu-frequency inokungena ngcono kwiindonga zomngxunya, inyusa ubukhulu kunye nokufana kokutyabeka ngaphakathi kwemingxunya, ehlangabezana neemfuno zokwaleka kwi-aspect ratio vias.
Ukonyuka kokuSebenza kwe-Electroplating: Iimpawu zokuphendula ngokukhawuleza ze-high-frequency switching power supply zivumela ulawulo lwangoku oluchanekileyo, ukunciphisa ixesha lokutya kunye nokwandisa ukusebenza kakuhle kwemveliso.
Ukusetyenziswa kwamandla okuNcitshiswa: Amandla okutshintsha okuhamba rhoqo anamandla aphezulu okuguqula kunye nokusetyenziswa kwamandla aphantsi, ukulungelelanisa kunye nesitayela sokwenziwa kohlaza.
I-Pulse Plating Capability: Ukunikezelwa kwamandla okutshintshela okuphakamileyo kunokukhupha ngokulula i-pulsed current, ivumela i-pulse electroplating. I-Pulse plating iphucula umgangatho wokugquma, kwandisa ukuxinana kokutyabeka, kunciphisa i-porosity, kwaye kunciphisa ukusetyenziswa kwezongezo.
3.Imizekelo yeSicelo soMbane woTshintsho oluPhakamileyo kwi-PCB Electroplating
A. Ukufakwa kweCopper: I-electroplating yobhedu isetyenziswa kwimveliso ye-PCB ukwenza umaleko we-conductive wesekethe. Izilungisi zokutshintsha i-high-frequency switching zibonelela ngoxinaniso lwangoku oluchanekileyo, ziqinisekisa ukubekwa komaleko wobhedu okufanayo kunye nokuphucula umgangatho kunye nokusebenza komgangatho ocwecwe.
B. Unyango loMphezulu: Unyango lwakumphezulu lwePCB, olufana negolide okanye isilivere yokucwenga, lukwafuna amandla azinzileyo eDC. Izilungisi zokutshintsha i-high-frequency switching rectifiers zinokubonelela ngoku ngokuchanekileyo kunye ne-voltage kwiintsimbi ezahlukeneyo zokucoca, ziqinisekisa ukuguda kunye nokumelana nokubola kwengubo.
C. I-Chemical Plating: i-chemical plating yenziwa ngaphandle kwangoku, kodwa inkqubo ineemfuno eziqinileyo zokushisa kunye nokuxinana kwangoku. Izilungisi zokutshintsha i-high-frequency switching ziyakwazi ukunika amandla ancedisayo kule nkqubo, inceda ukulawula amazinga eplating.
4.Indlela yokumisela iiNgcaciso zoBonelelo lwaMandla ePCB ye-Electroplating
Iinkcukacha zobonelelo lwamandla e-DC olufunekayo kwi-PCB electroplating luxhomekeke kwizinto ezininzi, kubandakanywa uhlobo lwenkqubo yokufakwa kwe-electroplating, ubungakanani bePCB, indawo yokucwenga, iimfuno zangoku zoxinaniso, kunye nokusebenza kakuhle kwemveliso. Apha ngezantsi kukho iiparamitha eziphambili kunye neenkcukacha zobonelelo lwamandla eziqhelekileyo:
A.Iinkcukacha zangoku
● Uxinaniso lwangoku: Uxinaniso lwangoku lwe-PCB electroplating ngokuqhelekileyo luqala ukusuka kwi-1-10 A/dm² (i-ampere nge-square decimeter), ngokuxhomekeke kwinkqubo yokufakwa kwe-electroplating (umz., ukucwenga kobhedu, ukucwenga kwegolide, ukufakwa kwe-nickel) kunye neemfuno zokugquma.
● Itotali yeeMfuno zangoku: Itotali yeemfuno zangoku ibalwa ngokusekelwe kummandla we-PCB kunye noxinano lwangoku. Umzekelo:
⬛Ukuba indawo yokucwenga ye-PCB yi-10 dm² kwaye uxinano lwangoku yi-2 A/dm², iyonke imfuno yangoku iya kuba ngama-20 A.
⬛Kwi-PCBs ezinkulu okanye imveliso yobuninzi, amakhulu aliqela e-ampere okanye neziphumo zangoku eziphezulu zinokufuneka.
Uluhlu lwangoku oluqhelekileyo:
●IiPCB ezincinci okanye ukusetyenziswa kwelabhoratri: 10-50 A
● Imveliso yePCB ephakathi: 50-200 A
● IiPCB ezinkulu okanye imveliso eninzi: 200-1000 A okanye ngaphezulu
B.IiNgcaciso zeVoltge
⬛PCB electroplating ngokubanzi ifuna amandla ombane asezantsi, ngokwesiqhelo kuluhlu lwe-5-24 V.
⬛Iimfuno zombane zixhomekeke kwizinto ezifana nokumelana nebhafu yokucoca, umgama phakathi kwe-electrode, kunye nokuhamba kwe-electrolyte.
⬛ Kwiinkqubo ezikhethekileyo (umz., i-pulse plating), amanqanaba ombane aphezulu (afana ne-30-50 V) anokufuneka.
Uluhlu lweVoltage oluqhelekileyo:
● I-electroplating ye-DC eqhelekileyo: 6-12 V
● I-Pulse plating okanye iinkqubo ezikhethekileyo: 12-24 V okanye ngaphezulu
Iintlobo zoBonelelo lwaMandla
● I-DC Power Supply: Isetyenziselwa i-DC electroplating yendabuko, ukubonelela ngokuzinzileyo kunye nombane.
● I-Pulse Power Supply: Isetyenziselwa i-pulse electroplating, ekwazi ukukhupha i-high-frequency pulsed currents ukuphucula umgangatho we-plating.
● I-High-Frequency Switching Power Supply: Ukusebenza okuphezulu kunye nokuphendula ngokukhawuleza, okufanelekileyo kwiimfuno ze-electroplating ezichanekileyo.
C.Power Supply Power
Amandla ombane ombane (P) agqitywe ngoku (I) kunye ne-voltage (V), kunye nefomula: P = I × V.
Ngokomzekelo, unikezelo lwamandla olukhupha i-100 A kwi-12 V luya kuba namandla angama-1200 W (1.2 kW).
Uluhlu lwamandla aqhelekileyo:
● Izixhobo ezincinci: 500 W - 2 kW
● Isixhobo esiphakathi: 2 kW - 10 kW
● Izixhobo ezikhulu: 10 kW - 50 kW okanye ngaphezulu
Ixesha lokuposa: Feb-13-2025
