I-Electroplating yinkqubo enomdla esetyenziswe kangangeenkulungwane ukuphucula ukubonakala nokuqina kwezinto ezahlukeneyo, ingakumbi ubucwebe. Le ndlela ibandakanya ukufaka umaleko wesinyithi kumphezulu ngokusebenzisa i-electrochemical reaction. Enye yezinto ezibalulekileyo kule nkqubo yi-electroplating rectifier, edlala indima ebalulekileyo ekuqinisekiseni ukusebenza kakuhle kunye nomgangatho womsebenzi we-electroplating. Kweli nqaku, siza kuhlola ukuba kuthatha ixesha elingakanani ukwenza ubucwebe be-electroplate kunye nokubaluleka kwe-electroplating rectifier ngeli xesha.
Inkqubo yokufakelwa nge-electroplating
Ngaphambi kokuba singene nzulu ekubeni kuthatha ixesha elingakanani ukwenza ubucwebe be-electroplate, kubalulekile ukuqonda inkqubo yokwenza ubucwebe nge-electroplate ngokwayo. Inkqubo iqala ngokulungiselela ubucwebe, obuhlala buquka ukucoca nokupolisha ukususa naluphi na ukungcola, igrisi, okanye ii-oxides. Eli nyathelo libalulekile kuba naluphi na ungcoliseko lunokuchaphazela ukunamathela komaleko wesinyithi.
Xa ubucwebe sele bulungile, bufakwa kwisisombululo se-electrolyte esinee-ion zesinyithi. Ubucwebe busebenza njenge-cathode (i-electrode engalunganga) kwisekethe ye-electroplating, ngelixa i-anode (i-electrode echanekileyo) idla ngokwenziwa ngesinyithi esiza kufakwa. Xa umbane wombane udlula kwisisombululo, ii-ion zesinyithi ziyancitshiswa kwaye zibekwe phezu kobuso bezinto zobucwebe, zenze umaleko omncinci wesinyithi.
Izinto ezichaphazela ixesha lokufakelwa kwe-electroplating
Ixesha elifunekayo lokufaka ubucwebe be-electroplate liyahluka kakhulu kuxhomekeke kwizinto ezininzi:
1. Ubukhulu Bokugquma: Ubukhulu bomaleko wesinyithi obufunekayo yenye yezinto eziphambili ezimisela ixesha lokufakelwa kwe-electroplating. Ukugquma okutyebileyo kufuna ixesha elingakumbi ukugqitywa, ngelixa ukugquma okuncinci kunokugqitywa ngokukhawuleza.
2. Uhlobo lwesinyithi: Iintsimbi ezahlukeneyo zifakwa ngamaxabiso ahlukeneyo. Umzekelo, igolide nesilivere zingathatha ixesha elincinci ukugcinwa kuneentsimbi ezinzima njenge-nickel okanye ubhedu.
3. Uxinano lwangoku: Ubungakanani bombane osetyenziswayo ngexesha lenkqubo ye-electroplating buchaphazela izinga lokufakwa. Uxinano lwangoku oluphezulu lunokukhawulezisa inkqubo ye-electroplating, kodwa lunokubangela nomgangatho ophantsi ukuba alulawulwa ngokufanelekileyo.
4. Ubushushu be-Electrolyte: Ubushushu be-electrolyte buchaphazela isantya senkqubo ye-electroplating. Okukhona ubushushu besisombululo buphezulu, kokukhona izinga lokufakwa kwesisombululo likhawuleza.
5. Umgangatho we-electroplating rectifier: I-electroplating rectifier yinxalenye ebalulekileyo eguqula i-alternating current (AC) ibe yi-direct current (DC) ukuze isetyenziswe kwinkqubo ye-electroplating. I-rectifier esemgangathweni ophezulu iqinisekisa i-current ezinzileyo nehambelanayo, ebalulekileyo ekufezekiseni i-electroplating efanayo. Ukuba i-rectifier ayisebenzi kakuhle, iya kubangela ukuguquguquka kwamanani, okuchaphazela izinga lokufakwa kunye nomgangatho uwonke we-electroplating.
Ixesha eliqhelekileyo lexesha lokusebenzisa ubucwebe be-Electroplating
Xa kujongwa ezi zinto zingasentla, ixesha elifunekayo lokufaka ubucwebe nge-electroplate lingahluka ukusuka kwimizuzu embalwa ukuya kwiiyure ezininzi. Umzekelo:
Ukugquma ngombane okulula: Ukuba ungathanda ukufaka umaleko omncinci wegolide okanye wesilivere kwiinjongo zokuhombisa, le nkqubo ingathatha imizuzu eli-10 ukuya kwengama-30. Oku kudla ngokwanela kwizinto zokuhombisa okanye izinto zokuhombisa ezinganxitywa rhoqo.
Iplati Ephakathi: Ukuze kugqitywe kakuhle, njengomaleko wegolide okanye we-nickel otyebileyo, inkqubo yoplati ingathatha naphi na ukusuka kwimizuzu engama-30 ukuya kwiiyure ezi-2. Eli xesha liza kuvelisa ilaphu eliqinileyo elinokumelana nokuguga kwemihla ngemihla.
Iplati etyebileyo: Xa kufuneka ubukhulu obukhulu, njengakwimisebenzi yemizi-mveliso okanye ubucwebe obuphezulu, inkqubo ingathatha iiyure ezininzi. Oku kuyinyani ngakumbi kwizinto ezifuna ukumelana neemeko ezinzima okanye ukusetyenziswa rhoqo.
Ukubaluleka koLawulo loMgangatho
Nokuba lingakanani na ixesha elichithwayo, ulawulo lomgangatho lubalulekile kwinkqubo yokufakelwa kwe-electroplating. Ukusebenzisa i-electroplating rectifier ethembekileyo kubalulekile ukugcina ukuhamba kombane rhoqo, okuchaphazela ngokuthe ngqo umgangatho womaleko ofakwe i-plated. Ukungahambisani kombane kunokukhokelela ekufakweni kwe-plating okungalinganiyo, ukunamathelana okubi kunye neziphene ezifana nokuqhekeka okanye ukudumba.
Ukongeza, ukugcinwa rhoqo kunye nokulinganiswa kwe-electroplating rectifier kuyimfuneko ukuqinisekisa ukusebenza kakuhle. Oku kuquka ukujonga iimpawu zokuguguleka okanye ukungasebenzi kakuhle kunye nokutshintsha iindawo njengoko kuyimfuneko.
Ngamafutshane, ixesha elifunekayo lokufaka ubucwebe be-electroplate linokwahluka kakhulu ngokuxhomekeke kwizinto ezininzi, kubandakanya ubukhulu bengubo obufunekayo, uhlobo lwesinyithi esisetyenzisiweyo, kunye nomgangatho we-rectifier ye-plating. Nangona i-plating elula ingathatha imizuzu embalwa kuphela, ukusetyenziswa okubanzi kunokwandisa inkqubo ukuya kwiiyure ezininzi. Ukuqonda ezi zinto ziguquguqukayo kubalulekile kubakhi bezinto zobucwebe kunye nabantu abathanda izinto zokuzonwabisa ngokufanayo, njengoko kuvumela ucwangciso olungcono kunye nokwenziwa kwenkqubo ye-electroplating. Ngokuqinisekisa ukuba i-rectifier ye-plating esemgangathweni ophezulu isetyenziswa kwaye igcinwa kwiimeko ezifanelekileyo, umntu unokufumana ubucwebe obuhle, obuhlala ixesha elide obuya kuma uvavanyo lwexesha.
Ixesha leposi: Novemba-25-2024
